Reliability Assessment of Solder Joints in Power Electronic Modules by Crack Damage Model for Wind Turbine Applications
نویسندگان
چکیده
Wind turbine reliability is an important issue for wind energy cost minimization, especially by reduction of operation and maintenance costs for critical components and by increasing wind turbine availability. To develop an optimal operation and maintenance plan for critical components, it is necessary to understand the physics of their failure and be able to develop reliability prediction models. Such a model is proposed in this paper for an IGBT power electronic module. IGBTs are critical components in wind turbine converter systems. These are multilayered devices where layers are soldered to each other and they operate at a thermal-power cycling environment. Temperature loadings affect the reliability of soldered joints by developing cracks and fatigue processes that eventually result in failure. Based on Miner’s rule a linear damage model that incorporates a crack development and propagation processes is discussed. A statistical analysis is performed for appropriate model parameter selection. Based on the proposed model, a layout for component life prediction with crack movement is described in details.
منابع مشابه
Reliability estimation with uncertainties consideration for high power IGBTs in 2.3 MW wind turbine converter system
This paper investigates the lifetime of high power IGBTs (insulated gate bipolar transistors) used in large wind turbine applications. Since the IGBTs are critical components in a wind turbine power converter, it is of great importance to assess their reliability in the design phase of the turbine. Minimum, maximum and average junction temperatures profiles for the grid side IGBTs are estimated...
متن کاملPredicting Fatigue of Solder Joints Subjected to High Number of Power Cycles
Solder joint reliability of SMT components connected to printed circuit boards is well documented. However, much of the testing and data is related to high-strain energy thermal cycling experiments relevant to product qualification testing (i.e., -55C to 125C). Relatively little information is available on low-strain, high-cycle fatigue behavior of solder joints, even though this is increasingl...
متن کاملMechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers
Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared with pressure based contact of metal conductor balls. Recently, flex-on-board interconnection has become more and more popular for mobile elect...
متن کاملOptimal and Reliable Design of the Bonding Wire for a Power Module by Using Reliability-based Design Optimization and a Kriging Metamodel
Power electronic modules are widely used in various industries such as aerospace, railway, automotive, alternative energy generation and distribution application for conversion and control of electrical power. An insulated gate bipolar transistor (IGBT) is a power module that is wildly used in various electric products such as power supplies, DC/DC converters and uninterruptible power systems. ...
متن کاملThermal Fatigue Life Prediction of Solder Joints in Avionics by Surrogate Modeling – a Contribution to Physics of Failure in Reliability Prediction
Manufacturers of aerospace, defense, and high performance (ADHP) equipment are currently facing multiple challenges related to the reliability of electronic systems. The continuing reduction in size of electronic components combined with increasing clock frequencies and greater functionality, results in increased power density. As an effect, controlling the temperature of electronic components ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2011